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Thin and flexible film packaging subject to OLED panel factory attention

2017-08-18 16:49:25 Ao-Mihoo Read


Abstract: Thin film Encapsulation (TFE) business is hot, according to the city of UBI Research 2017 OLED packaging annual report pointed out that about 2021 will be 70% of the OLED panel using thin film packaging technology.


Thin film Encapsulation (TFE) business opportunities, according to the city of UBI Research 2017 OLED packaging annual report pointed out that about 2021 will be 70% of the OLED panel using thin film packaging technology.


TFE package for narrow bezel, and full-screen borderless flexible OLED display panel technology.


UBI Research analyst Jang Hyunjun said that the TFE package is expected to be suitable for narrow borders, as well as full-screen borderless flexible OLED display panel technology, the related manufacturing equipment and materials market will continue to develop.


(Flexibe) OLED is considered to meet these requirements; therefore, Samsung display (Samsung Display), LG display (the display), the display screen is moving toward the border, or full-screen borderless trend, and flexible (Flexibe) OLED is considered to meet such requirements; LG Display), as well as China's panel makers are vigorously betting on the production of flexible OLED production line, rather than the traditional hard (Rigid) OLED.


Flexible OLEDs must be thin and flexible, so past glass materials are not suitable for use in such packages and must be TFE or hybrid packaging technology. It is understood that the structure of TFE is through the layers of inorganic and organic materials stacked, in the early stages of development, it has 11 layers of organic / inorganic material deposition, so the yield is very low; but now his deposition number has been reduced to 3 layers, and significantly increase productivity, yield, and cost reduction, and is heavily used in flexible OLEDs.


In addition, the use of barrier film (Barrier Film) hybrid packaging technology is often used in flexible OLED, but because of the high cost of barrier film, and the thickness is thick, so most of the recent focus on display manufacturers are still TFE applications The


It is also mentioned in this report that the key to TFE manufacturing is the use of inorganic materials to form plasma assisted chemical vapor deposition (PECVD), coupled with organic materials made of inkjet printing (Ink-jet Printer). It is worth mentioning that, due to PECVD mixed packaging and TFE inorganic materials used, it is estimated that 2017 ~ 2021 PECVD market will reach 6.82 billion US dollars, while the overall packaging and manufacturing equipment market accounted for 62% of its share.

   

                                                                                                                                                                                                      Editor: Mae


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